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Meet us at Eurosensors 2010 in Linz

InSensor will present new results on high performance piezoelectric thick films at the Eurosensors XXIV in Linz, Austria

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Meet us at Electroceramics XII in Trondheim

The presentation will be given by Karsten Hansen on June 15 in session Piezoelectric materials III and the title is, Focused high frequency lead-free transducers based on piezoelectric thick films

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Meet us at IDTechEx Energy Harvesting & Storage Europe in Munich

The presentation will be given by Dr. Tomasz Zawada on May 27 and the title is, High Coupling Piezoelectric Thick Film Materials

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Our Vision

´To expand the market for piezo-based integrated sensors and ultrasonic devices, and thereby offer specialized online control and monitoring capabilities to a large proportion of new systems in the electronic, medical, chemical and mechanical industries.´

Who we are

  • Founded 2004 with technology transfer from Ferroperm Piezoceramics A/S
  • Owned by MEGGITT PLC since 2008
  • Merged with Ferroperm Piezoceramics A/S July 2009
  • Is a part of Meggitt Sensing Systems
  • Build on the foundations of more than 10 years of R&D witin thick-film technology and fundamental materials science
  • A company that is committed to pioneer an emerging technology with an enormous growth potential

What we do

Develop and produce piezoelectric thick-film components based on:

  • Silicon substrates
  • Stainless steel substrates
  • Porous PZT substrates
  • Alumina substrates
  • LTCC substrates
  • Integrate piezoceramics with conventional electronic components such as capacitors, resistors, coils etc.
  • Allow for an easier and improved manufacturing process of high-frequency ultrasound devices
  • Provide new technological capabilities for unprecedented integration of piezoelectric devices and electronics


´It is the strategy of InSensor® to be an OEM provider to major suppliers of electronic systems. The development projects should always be carried out in close co-operation with the customer, and aimed at direct development of products that can fit into the customer's new or existing systems.´