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Meet us at Eurosensors 2010 in Linz

InSensor will present new results on high performance piezoelectric thick films at the Eurosensors XXIV in Linz, Austria

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Meet us at Electroceramics XII in Trondheim

The presentation will be given by Karsten Hansen on June 15 in session Piezoelectric materials III and the title is, Focused high frequency lead-free transducers based on piezoelectric thick films

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Meet us at IDTechEx Energy Harvesting & Storage Europe in Munich

The presentation will be given by Dr. Tomasz Zawada on May 27 and the title is, High Coupling Piezoelectric Thick Film Materials

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InSensor®'s technology is a perfect solution for manufacturing integrated sensors for a variety of applications, including:

  • Strain gauges
  • Knock sensors
  • Pressure sensors
  • Hydrophones
  • Viscosity sensors
  • etc.
The final function of the device depends on the working principle, but it must be pointed out that the sensors can be based on the following generic structures:
  • Membrane
  • Cantilever
  • Bridge
  • Cross-bridge
  • etc.

MEMS Accelerometers

Due to its compatibility with MEMS it has already been applied in the fabrication of integrated uni- and tri-axial vibration sensors (accelerometers).

The tri-axial structure consists of a seismic mass suspended on four bridges/beams. The beams are equipped with active transdusing parts. The beams are deformed by the seismic mass due to acceleration and the output signal is generated. The actual direction of the acceleration is read from the four-beam response.

Working principle of the tri-axail accelerometer

The fabricated chip together with the detailed structure of tri-axial accelerometer is given below.

Fabricated accelerometer